The 3534 liquid epoxy, glob-top encapsulant is said to be particularly well-suited for chip-on-board applications involving components that do not offer potting indentations. The epoxy offers controlled flow and can penetrate through wire leads.
The encapsulant cures in 30 minutes at 150°C and is designed to minimize stress, resist chemicals, and improve temperature cycling performance.
Sponsored Recommendations
Sponsored Recommendations
Comments
Comments
To join the conversation, and become an exclusive member of Electronic Design, create an account today!
Sponsored
Sponsored