Solder Inspection Systems Can See Under Components

The IS-1000 solder-joint inspection system provides users with the ability to inspect solder balls even if they happen to be under board components. Images are captured on video for what is said to be a fraction of the cost of x-ray inspection.
The system incorporates a special non-glare light source to gather the image for viewing and provides magnifications of up to 140X on a 14" monitor. It can be used to identify lifted leads, cracks, solder balls, bridging, cold-solder joints, and misalignment, as well as BGA, CSP, QFP and LGA solder joints.