Ultra-Mini SMT Relay Can Take The Heat

April 1, 2001

1 of Enlarge image

The 9800 series of ultra-miniature SMT reed relays utilize a higher temperature solder and solder paste for internal connections. The solder alloy, Sn95/Sb5, allows for a maximum board reflow temperature of 226°C for one minute as measured at the component leads.
The component combines small size with top RF performance, making it suitable for use in communications systems and instrumentation and fast rise time pulse switching up to 6 GHz.

Company: COTO TECHNOLOGY

Product URL: Click here for more information

Continue Reading

Solving the contact resistance challenge for 7nm and beyond CMOS

Flash Memory Takes Over

Sponsored Recommendations

The Importance of PCB Design in Consumer Products

April 25, 2024

Explore the importance of PCB design and how Fusion 360 can help your team react to evolving consumer demands.

PCB Design Mastery for Assembly & Fabrication

April 25, 2024

This guide explores PCB circuit board design, focusing on both Design For Assembly (DFA) and Design For Fabrication (DFab) perspectives.

What is Design Rule Checking in PCBs?

April 25, 2024

Explore the importance of Design Rule Checking (DRC) in manufacturing and how Autodesk Fusion 360 enhances the process.

Unlocking the Power of IoT Integration for Elevated PCB Designs

April 25, 2024

What does it take to add IoT into your product? What advantages does IoT have in PCB related projects? Read to find answers to your IoT design questions.