Popular MCUs Now Come In Smaller Packages

July 1, 2002

A number of the company’s PICmicro OTP and flash microcontrollers are now available in the smaller MicroLeadframe (MLF) package that eliminates conventional side leads. The reduction in package height and mass is said to make the devices 50% smaller than typical SSOP packages. The package also employs the company’s ExposedPad technology, whereby the die paddle is exposed and can be soldered directly to the printed circuit board. The first devices will be available in two, eight-lead 6 mm x 6 mm packages with a common pitch size of 0.65 mm and are competitively priced with typical SOIC devices. The initial offering will include four OTP devices (PIC16C62B, PIC16C63A, PIC16C72A and PIC16C73B) and two flash devices (PIC16F73 and PIC16F76). Prices range from $2.70 to $3.82 each/1,000. Additional devices ranging from eight- to 40-lead packages are also planned for this year. MICROCHIP TECHNOLOGY INC., Chandler, AZ. (480) 792-7668.

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