Encapsulant Protects CSPs And BGAs

April 6, 2004
For mobile phones and other handheld products, CN-1432 re-workable, under-fill encapsulant protects CSP and BGA devices from shock, vibration, and repetitive keypad actuations. The material exhibits a viscosity of 4,500 cps and flows to a distance of

For mobile phones and other handheld products, CN-1432 re-workable, under-fill encapsulant protects CSP and BGA devices from shock, vibration, and repetitive keypad actuations. The material exhibits a viscosity of 4,500 cps and flows to a distance of 18 mm in as little as 15 sec. It self-fillets to eliminate the need for seal passes to create complete and symmetrical fillets. After flow is complete, the board can be cured in an in-line oven for five minutes at 165°C. Device removal is achieved by heating the defective CSP or BGA and the under-fill encapsulant to 220°C and, after device removal, residues may be easily scraped or brushed away. ZYMET INC., East Hanover, NJ. (973) 428-5245.

Company: ZYMET INC.

Product URL: Click here for more information

About the Author

Staff

Articles, galleries, and recent work by members of Electronic Design's editorial staff.

Sponsored Recommendations

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!