\[August 24, 2006\] The latest line of B2B high-density, SMT connectors assume position as the industry's most robust solution for 1.27-mm pitch, board-stacking applications. The components employ screw-machined terminals with multi-finger contacts and the company's proprietary solder-ball terminal design. With a current rating of 3A per pin, more contacts are assignable for data/signal transfers while relegating fewer pins for power/ground chores. Other features include a redesigned molded LCP insulator that promises a more rugged and durable contact system for blind mating applications. The connectors are available with 1.27-mm pitch footprints in 240, 300, or 400 positions with mated heights from 6 mm to 12.7 mm. Custom designs and RoHS-compliant Sn/Ag/Cu solder ball terminals are also available. ADVANCED INTERCONNECTIONS CORP., West Warwick, RI. (800) 424-9850.
Company: ADVANCED INTERCONNECTIONS CORP.
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