Module And Motherboard Enable Low-Power Embedded Applications

Oct. 8, 2008
For applications where low power consumption and minimal heat dissipation are key requirements, the bCOM2-L8000 COM Express module and the mITX-945S-ED motherboard employ low-power Intel Atom processors running at 1.6-GHz. The bCOM2-L8000, a basic

For applications where low power consumption and minimal heat dissipation are key requirements, the bCOM2-L8000 COM Express module and the mITX-945S-ED motherboard employ low-power Intel Atom processors running at 1.6-GHz. The bCOM2-L8000, a basic form factor, Type 2 pinout module, features a typical power envelope of 10W to 12W and provides an alternative to the bCOM2-L1000 COM Express module. Its I/O capability includes one Gigabit Ethernet port, two Serial ATA interfaces, support for up to two IDE devices, and eight USB 2.0 ports while expansion can be achieved via three PCI Express lanes with support for up to four devices via the PCI bus. The mITX-945S-ED offers the same I/O functionality and includes two Gigabit Ethernet ports, PCI Express and PCI expansion slots, a COM port, two Serial ATA ports, support for up to two IDE devices and four (optionally expandable to eight) USB 2.0 ports. For more information and prices, call GE FANUC INTELLIGENT PLATFORMS, Charlottesville, VA. (434) 978-5000.

Company: GE FANUC INTELLIGENT PLATFORMS

Product URL: Click here for more information

About the Author

Staff

Articles, galleries, and recent work by members of Electronic Design's editorial staff.

Sponsored Recommendations

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!