Gallery: VITA 59 Defines Rugged COM Express

Jan. 22, 2014
VITA 59 is ready to go. The VITA standard defines a rugged module form factor that builds on the PICMG COM Express standard.

VITA 59 is ready to go. The VITA standard defines a rugged module form factor that builds on the PICMG COM Express standard. It utilizes similar pinouts while changing details like the mounting tabs designed for conduction cooling. MEN Micro will be first out the chute with compatible hardware. The new standard targets application areas that require rugged, safety critical applications such as avionics, military and transportation. MEN was highlighting the technology at the recent VITA Embedded Tech Trends conference.

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