Thermagon, Inc.

Oct. 1, 2000

New T-path 200 Series gap filler is the latest innovation from Thermagon, Inc. Offering solid thermal performance at half the cost of premium pads, T-path 200 is suitable for high and low volume applications. This material is resilient and compliant, yet strong and puncture resistant, easily blanketing uneven surfaces and filling air gaps. T-path is naturally tacky on one side only — no adhesive needed to compromise thermal performance. Natural tack allows for T-path to adhere to one side of a mating part, while separating easily from the other. With a thermal conductivity of 1.5 w/mK, and a UL rating of 94V-0, this material is recommended for RDRAM memory modules, CD-ROMS, plasma display panels, automotive engine control units, telecommunication switching equipment and many more. T-path is a distinctive orange color and is available in thickness from 0.020" (0.50mm) to 0.200 (5mm). Supplied as a standard 9" x 9" sheet, die cut to your specifications or on a roll.

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