TechView: The Industry -- More On Automated Measurement System For Compliance Testing

Aug. 4, 2003
Compliance and analysis software, Tektronix oscilloscopes, and leading probes, combine to expedite critical compliance and validation testing of leading serial buses. "The new RT-Eye package and the P7350SMA probe will save precious time for...

Compliance and analysis software, Tektronix oscilloscopes, and leading probes, combine to expedite critical compliance and validation testing of leading serial buses.

"The new RT-Eye package and the P7350SMA probe will save precious time for designers proof-testing their serial products for compliance. We anticipate that at least half of our TDS6000 and TDS/CSA7000 series users will want these new tools, while the new TMS817 support package will enable PCI Express developers to more quickly solve problems at the logical level" says Colin Shepard, Tektronix's vice president, for oscilloscope products.

Beyond known standards, waveform masks, measurement limits, and reporting functions can be customized by the user, enabling companies and industry groups working on proprietary and emerging standards to develop their own internal and external compliance programs and reports. Once a standard matures to the point where the industry group has decided their compliance tests, a standard specific Compliance Module (which uses the RT-Eye software as its measurement engine) will be made available.

RTE boasts a total jitter bit-error rate (BER) of 10-12. The P7350SMA differential probe has a 5-GHz bandwidth and true differential connectivity via SMA connectors, to accurately capture 2.5-Gbit/s signals. It supplements the existing P7350 probe, which is equipped with conventional movable contacts. Both probes, because they consume only one oscilloscope input for each two-sided differential signal, enable multi-channel measurements at the oscilloscope's maximum sample rate.

The TMS817 PCI Express support package consists of a hardware unit with detachable probe cables, and software tools for real-time display and analysis of the signals. The TMS817 simplifies debug and validation work with its ability to deskew, decode, and descramble serial data, recover embedded clocks, and trigger on specific packet attributes. Both "mid-bus" and interposer probes are available, providing reliable contact to the device under test via "lands" on the device or edge connectors. The TMS817 acquires signals at data rates up to 2.5 Gbits/s, consistent with PCI Express requirements.

Tektronix Inc. (800) 426-2200, request code 1295www.tektronix.com
About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.

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