19-in. MIL Rugged Enclosures Support Multiple Air-Cooled Options
Pixus Technologies’ series of MIL rugged 19-in. enclosures feature a front-to-rear airflow path. Versions with side-to-side cooling are also optional. They’re designed to work with high cubic feet/minute (CFM) fans. The chassis are designed for MIL-STD-810 for shock/vibration/environmental and MIL-STD-461 for EMI, and related specifications.
The enclosures handle a range of backplanes, such as those supporting Eurocard, OpenVPX, and SOSA-aligned systems. The systems come in multiple sizes and configuration options, including 2U, 4U, 5U, and 6U board height, along with various depths. They support rear transition modules (RTMs), and can be configured to work with a variety of power and I/O options.
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William G. Wong
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