689a1e3f742efd76a3453895 250530 Prodmod Bourns Line Filterspromo

Inductive Reasoning: Enhanced Common-Mode Inductors + Semi-Shielded Inductors

Aug. 11, 2025

Bourns’ low-profile common-mode inductors feature high impedance over a wide frequency range while their rugged, semi-shielded inductors offer cost-effective automotive-grade solutions.

Lee Goldberg

Related To:

Electronic Design

The SRF1209U4 series of common-mode chip inductors developed by Bourns Inc. is designed for noise suppression in signal transmission-line applications. They feature a low-profile, compact footprint that helps designers meet space-constrained design requirements. The new inductors also provide high impedance over a high-frequency range, offering an enhanced signal-to-noise ratio.

The inductors are compatible with USB 3.1 Gen 1/2, HDMI 2.0/2.1, USB 4.0, and Thunderbolt interfaces. They have an operating temperature range of −40 to +125°C, impedance up to 90 Ω, current ratings up to 400 mA, and a direct current resistance (DCR) of 0.3 Ω. For more detailed product information, click here.

The company also added five new product series to the existing Bourns SRN-BTA family, which offer higher maximum inductor values while delivering lower magnetic-field radiation. The new additions bring enhanced product reliability with bottom-soldered lead-wires. Thus, they offer a cost-effective alternative to fully shielded ferrite-based inductors for applications in automotive systems, DC-DC converters, and power supplies across consumer, industrial, and telecom electronics..

Click on the following links for additional product information: SRN2010/2510/3010/3015/4018BTA.

Next in This Edition of PowerBites

satellite_dreamstime_andreyiarmiagov_43333062_prom

Space-Rated MOSFET Family Adds First Rad-Tolerant P-Channel Device

Infineon’s radiation-tolerant 60-V P-channel MOSFET offers a cost-effective option for LEO satellites and other “NewSpace” applications.

How Low Can You Go? Current-Sense Resistor Series Adds 0.2-Ω Value

The resistor, developed by Stackpole, addresses the demands of modern power-management and control designs.

More PowerBites

This Week in PowerBites

Check out the latest from power technology expert Lee Goldberg.

PowerBites: Passives/Packaging Advances Share the Spotlight with Barnstorming “UFOs”

A plethora of passives and packaging technologies and elevated electric aviation share the spotlight with yet another debate about hydrogen power in this edition of PowerBites...

About the Author

Lee Goldberg | Contributing Editor

Lee Goldberg is a self-identified “Recovering Engineer,” Maker/Hacker, Green-Tech Maven, Aviator, Gadfly, and Geek Dad. He spent the first 18 years of his career helping design microprocessors, embedded systems, renewable energy applications, and the occasional interplanetary spacecraft. After trading his ‘scope and soldering iron for a keyboard and a second career as a tech journalist, he’s spent the next two decades at several print and online engineering publications.

Lee’s current focus is power electronics, especially the technologies involved with energy efficiency, energy management, and renewable energy. This dovetails with his coverage of sustainable technologies and various environmental and social issues within the engineering community that he began in 1996. Lee also covers 3D printers, open-source hardware, and other Maker/Hacker technologies.

Lee holds a BSEE in Electrical Engineering from Thomas Edison College, and participated in a colloquium on technology, society, and the environment at Goddard College’s Institute for Social Ecology. His book, “Green Electronics/Green Bottom Line - A Commonsense Guide To Environmentally Responsible Engineering and Management,” was published by Newnes Press.

Lee, his wife Catherine, and his daughter Anwyn currently reside in the outskirts of Princeton N.J., where they masquerade as a typical suburban family.

Lee also writes the regular PowerBites series.