TOLT Package Thermally Enhances MOSFET for E-Scooters and LEVs
The new 80-V MXT MV MOSFET, dubbed the MDLT080N017RH, from Magnachip Semiconductor features a TOLT (TO-leaded top-side cooling) package that offers improved thermal management.
Unlike conventional TOLL (TO-leadless) packages that dissipate heat through the bottom, the TOLT package is engineered to release heat directly from the top via a mounted metal heatsink. Its reduced thermal resistance between the junction and the external environment suits it for thermally demanding applications, such as e-scooters and light electric vehicles (LEVs).
Simulations and tests conducted by Magnachip demonstrated that the new TOLT package solution achieved an average 22% reduction in junction temperature compared to using standard TOLL packages. Designers can use the TOLT package’s high power density and efficient thermal flow to create compact, lightweight, cool-running designs that enjoy longer lifespans and higher reliability.
Visit Power Solutions > MXT MOSFETs > 80V for additional information.