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Rugged BJTs Use Clip-Bonded Packaging to Save Cost, Space

Sept. 17, 2025

Nexperia’s clip-bonded FlatPower package offers a compact and cost-efficient option for bipolar-junction-transistor devices in industrial and automotive settings.

Lee Goldberg

Related To:

Electronic Design

The latest series of rugged bipolar junction transistors (BJTs) from Nexperia are available in clip-bonded FlatPower (CFP15B) packaging, which delivers significant board, space, and cost advantages over traditional DPAK packaging.

Suitable for use in demanding industrial and automotive applications, such as battery-management system (BMS) power supplies and onboard chargers in EVs, and backlighting for video displays, the CFP15B package offers exceptional mechanical robustness and thermal performance. In addition, it delivers extremely stable equivalent thermal performance (up to 175°C operation for automotive applications) while offering a 53% smaller soldering footprint.

The new portfolio includes six automotive-qualified (e.g., MJPE31C-Q) and six industrial-grade types (e.g., MJPE44H11). They feature V_CEO ratings of 50, 80, and 100 V, and collector currents (I_C) of 2, 3, and 8 A. Both NPN and PNP variants are available.

Visit the company’s site to learn more about Nexperia’s portfolio of bipolar junction transistors.

About the Author

Lee Goldberg | Contributing Editor

Lee Goldberg is a self-identified “Recovering Engineer,” Maker/Hacker, Green-Tech Maven, Aviator, Gadfly, and Geek Dad. He spent the first 18 years of his career helping design microprocessors, embedded systems, renewable energy applications, and the occasional interplanetary spacecraft. After trading his ‘scope and soldering iron for a keyboard and a second career as a tech journalist, he’s spent the next two decades at several print and online engineering publications.

Lee’s current focus is power electronics, especially the technologies involved with energy efficiency, energy management, and renewable energy. This dovetails with his coverage of sustainable technologies and various environmental and social issues within the engineering community that he began in 1996. Lee also covers 3D printers, open-source hardware, and other Maker/Hacker technologies.

Lee holds a BSEE in Electrical Engineering from Thomas Edison College, and participated in a colloquium on technology, society, and the environment at Goddard College’s Institute for Social Ecology. His book, “Green Electronics/Green Bottom Line - A Commonsense Guide To Environmentally Responsible Engineering and Management,” was published by Newnes Press.

Lee, his wife Catherine, and his daughter Anwyn currently reside in the outskirts of Princeton N.J., where they masquerade as a typical suburban family.

Lee also writes the regular PowerBites series.