High-Density Dual-Pack IGBT Modules Simplify System Integration

A new family of efficient and reliable DualPack 3 (DP3) power modules from Microchip Technology is intended to help designers create simpler, more compact, and cost-effective power-management solutions. Their high efficiency, compact footprint, and advanced protection features make suit them for industrial drives, renewables, traction, energy storage, and agricultural vehicles.

Fabricated with Microchip’s advanced IGBT7 technology, they come in six variants at 1,200 and 1,700 V with high current ranging from 300 to 900 A. The modules address many of the common challenges of general-purpose motor-drive applications such as dv/dt, complexity in driving, higher conduction losses, and no overload capability.

In addition, the module’s advanced fabrication process enables them to reduce power losses by up to 15% to 20% (compared Microchip’s IGBT4 devices). Their robust packaging allows them to operate reliably at temperatures of up to 175°C during overload.

Available in a phase-leg configuration, the DP3 power modules’ compact footprint of approximately 152 × 62 × 20 mm enables a frame size jump for increased power output. It also eliminates the need for paralleling multiple of modules in many applications. On top of that, DP3 modules provide a second-source option to industry-standard EconoDUAL packages for greater flexibility and supply-chain security.

The DualPack 3 power modules are now available in production quantities. For more information, visit the product web page.