Hi-Rel 600-V SiC Power Modules Come in Multiple Configurations
Microchip Technology introduced its BZPACK mSiC power module family at the recent APEC 2026. The series was designed to meet the stringent High Humidity High Voltage High Temperature Reverse Bias (HV‑H3TRB) standard and provide high reliability, streamlining manufacturing.
The modules are available in a wide range of topologies, including half-bridge, full-bridge, three-phase and PIM/CIB configurations. They give designers a large set of system‑integration options for power‑conversion applications in demanding industrial, renewable energy, and automotive (AEC-Q101) environments.
The MB and MC families of mSiC MOSFETs support common gate-source voltages (VGS ≥ 15 V) and come in industry-standard, pin-compatible packages for ease of integration. The MC family integrates a gate resistor, thus improving switching control, maintaining low switching energy, and enhancing stability in multi-die module configurations. Current options are available in TO-247-4 Notch and die form (waffle pack).
Tested to meet HV-H3TRB standards that exceed the 1,000-hour standard, the BZPACK modules provide confidence for deployments in industrial and applications. With a Comparative Tracking Index (CTI) 600-V case, stable RDS(on) across temperature ranges, and substrate options in aluminum oxide (Al₂O₃) or aluminum nitride (AlN), the modules offer superior insulation, thermal management and long-term durability.
In addition, all modules feature a compact, baseplate-less design with press-fit, solderless terminals and optional pre-applied thermal interface material (TIM).
The BZPACK mSiC power modules are now available in production quantities.
>Check out more of our APEC 2026 coverage
About the Author
Lee Goldberg
Contributing Editor
Lee Goldberg is a self-identified “Recovering Engineer,” Maker/Hacker, Green-Tech Maven, Aviator, Gadfly, and Geek Dad. He spent the first 18 years of his career helping design microprocessors, embedded systems, renewable energy applications, and the occasional interplanetary spacecraft. After trading his ‘scope and soldering iron for a keyboard and a second career as a tech journalist, he’s spent the next two decades at several print and online engineering publications.
Lee’s current focus is power electronics, especially the technologies involved with energy efficiency, energy management, and renewable energy. This dovetails with his coverage of sustainable technologies and various environmental and social issues within the engineering community that he began in 1996. Lee also covers 3D printers, open-source hardware, and other Maker/Hacker technologies.
Lee holds a BSEE in Electrical Engineering from Thomas Edison College, and participated in a colloquium on technology, society, and the environment at Goddard College’s Institute for Social Ecology. His book, “Green Electronics/Green Bottom Line - A Commonsense Guide To Environmentally Responsible Engineering and Management,” was published by Newnes Press.
Lee, his wife Catherine, and his daughter Anwyn currently reside in the outskirts of Princeton N.J., where they masquerade as a typical suburban family.
Lee also writes the regular PowerBites series.