APEC 2026

Stay on top of the technologies and trends in focus at APEC 2026 and hear from industry insiders on the state of the power electronics industry.
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March 9, 2026
2 min read
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Welcome to Electronic Design's coverage of APEC 2026. You can find links to our latest articles, videos, and podcasts. Stop in regularly to see the latest coverage as it goes live, or sign up for the Power and Analog newsletter to get the latest stories sent right to your inbox. You can check out the latest newsletters here.

If you or your company are attending the conference, you're welcome to send news or information about demos and in-person meeting opportunities with the Electronic Design team to Senior Editor James Morra. You can find contact information here.

Table of Contents

Featured

EndeavorB2B, Lee Goldberg, and Hugmans Oasis
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Three of Electronic Design’s most colorful editors will be attending North America’s leading power conference and would love to meet you if you’re planning to attend APEC 2026...
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Inside Electronics
Ferric is positioning its integrated voltage regulators as “power chiplets” built to be co-packaged with high-performance GPUs and other chips.
TDK Corp. (and Tony Vitolo/EndeavorB2B)
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Delve into the details of vertical power delivery and how it surmounts the limits of traditional lateral power when it comes to supporting secondary power rails.

Multimedia

Here are the latest videos and podcasts related to power electronics and APEC 2026.

Electronic Design
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Check out our latest podcast featuring Alix Paultre, along with other special hosts from our editorial staff.

More Show Coverage

The features above are only part of the content that's new on Electronic Design. Check out the rest here.

Empower Semiconductor
Empower Semiconductor embedded silicon capacitors
Embedded silicon capacitors, or ECAPs, aim to solve issues of power integrity from inside the processor’s package.
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TDK said the DC-DC converter is already used in Altera’s Agilex family of FPGAs and AMD’s programmable SoCs, including AI-class processors in its Versal family.

More APEC Coverage from the Archives

These articles, selected by Electronic Design's editors, revisit coverage from past shows.

Texas Instruments
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eFuses integrate power switches, digital controllers, current sensing, and all of the other smarts for hot swapping in a single chip. For TI, they represent the future of circuit...

More Event Coverage on Electronic Design

Electronic Design's editors have been on the ground at several conferences and trade shows this year. Start exploring highlights from their coverage here.

William Wong | Santa Clara Convention Center
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Editor Bill Wong’s observations from the recent 2026 Chiplet Summit.
William Wong/EndeavorB2B
Las Vegas Convention Center
CES presented some interesting tech on the floor — and behind closed doors.

About the Author

James Morra
Email

James Morra

Senior Editor

James Morra is the senior editor for Electronic Design, covering the semiconductor industry and new technology trends, with a focus on power electronics and power management. He also reports on the business behind electrical engineering, including the electronics supply chain. He joined Electronic Design in 2015 and is based in Chicago, Illinois.

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