High-Precision Power Monitoring and Reporting IC Builds in Protection IPs
Infineon Technologies expanded its XDP protection and monitoring portfolio with the XDM700-1, a system monitoring and reporting IC for high- or low-side current and voltage sensing that features an input voltage range of up to 80 V.
Utilizing XDP7xx protection as a platform, the XDM700-1 provides precise, real-time measurements, as well as monitoring and reporting capabilities, for a wide range of target applications. They include AI and cloud server systems, telecommunications equipment, power management, power supplies, robotics, test equipment, and renewable-energy systems.
The IC, introduced at APEC 2026, integrates 12-bit voltage and current ADCs and a 5-V regulator with 10-mA output capability that offers high-precision measurement accuracy of up to 0.4% for voltage, 0.75% for current, 1.15% for power, and 2.7% for energy. There’s a four-level programmable current-sense differential range of 12.5, 25, 50, and 100 mV.
The monitor provides reporting in analog form via the IMON pin and in a digital format via a PMBus 1.3 interface operating at 1 MHz. Additional features include reporting telemetry of peaks and valleys as well as programmable warnings for overcurrent, input undervoltage, input overvoltage, output undervoltage, output overvoltage, input overpower, and overtemperature.
The XDM700-1 uses Infineon’s XDP7xx protection IPs and infrastructure to enable high-precision system monitoring and reporting for mission-critical computing and energy applications from grid to core. Among the targets are solid-state transformers and circuit breakers, high-voltage and intermediate bus conversion, as well as second-stage DC conversion power modules.
Samples of the XDM700-1 are available now, with production starting in April 2026. It’s offered in an industry-standard VQFN-24 pin package measuring 4- x 4-mm2 with −40 to +125°C junction temperature.
>>Check out more of our APEC 2026 coverage
About the Author
Lee Goldberg
Contributing Editor
Lee Goldberg is a self-identified “Recovering Engineer,” Maker/Hacker, Green-Tech Maven, Aviator, Gadfly, and Geek Dad. He spent the first 18 years of his career helping design microprocessors, embedded systems, renewable energy applications, and the occasional interplanetary spacecraft. After trading his ‘scope and soldering iron for a keyboard and a second career as a tech journalist, he’s spent the next two decades at several print and online engineering publications.
Lee’s current focus is power electronics, especially the technologies involved with energy efficiency, energy management, and renewable energy. This dovetails with his coverage of sustainable technologies and various environmental and social issues within the engineering community that he began in 1996. Lee also covers 3D printers, open-source hardware, and other Maker/Hacker technologies.
Lee holds a BSEE in Electrical Engineering from Thomas Edison College, and participated in a colloquium on technology, society, and the environment at Goddard College’s Institute for Social Ecology. His book, “Green Electronics/Green Bottom Line - A Commonsense Guide To Environmentally Responsible Engineering and Management,” was published by Newnes Press.
Lee, his wife Catherine, and his daughter Anwyn currently reside in the outskirts of Princeton N.J., where they masquerade as a typical suburban family.
Lee also writes the regular PowerBites series.