POL Converters Feed Proliferating Power Rails in AI Chips
As next-generation AI chips move into the multi-kilowatt range, power architectures are being pushed to their limits. The core power rails in chips such as NVIDIA's Blackwell GPU require extreme currents of several thousand amps and ultra-fast transient response times, and future platforms like NVIDIA's Rubin GPU are expected to push these demands even further.
At the same time, the number of non-core rails is increasing rapidly, each requiring compact, efficient regulation with precise monitoring and control.
At APEC last month, Infineon introduced a family of fully integrated DC-DC buck regulators aimed at these non-core rails: the TDA49720, TDA49712, and TDA49706. The devices complement the company’s higher-current multiphase voltage regulators. They're targeted at the core rails in GPUs and other processors such as Arm's chiplet-based AGI CPU that support them during AI training and inference. The all-in-one power modules are capable of delivering power vertically up through the circuit board.
The point-of-load (POL) converters can deliver 6, 12, and 20 A of current in compact 3- × 3-mm and 3- × 3.5-mm packages. Infineon said the small footprint allows placement close to the load, improving power density and simplifying layout within densely packed accelerator cards and server boards. The devices operate over a 2.7- to 16-V input range and across junction temperatures of –40 to 150°C.
The chips also come with PMBus-compliant digital telemetry. This enables accurate reporting of important parameters, including output voltage, load current, input voltage, and die temperature, leading to system-level optimization and reliability monitoring.
Infineon said a proprietary valley current-mode, constant on-time control scheme enables fast transient response and cycle-by-cycle current limiting. That also helps enable stable operation required by all-MLCC output-capacitance designs.
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About the Author
James Morra
Senior Editor
James Morra is the senior editor for Electronic Design, covering the semiconductor industry and new technology trends, with a focus on power electronics and power management. He also reports on the business behind electrical engineering, including the electronics supply chain. He joined Electronic Design in 2015 and is based in Chicago, Illinois.


