Cool-Running Solutions Meet AI Core, AI Factory, and Industrial Power Challenges

At APEC 2026, Alpha and Omega Semiconductor (AOS) showcased its latest power-management solutions directed at AI core, AI factory and industrial power needs. The exhibit contained examples of several categories of products created to address the challenges of power management in critical applications within data centers and industrial power systems.

For AI core applications, AOS introduced two new controllers:

• The AOZ73216QI is the company’s latest 16-phase, 2-rail controller specifically designed for high-performance GPUs and SoCs used in graphics cards, AI compute, and AI data centers. Based on AOS’s proprietary Advanced Transient Modulator (A²TM) control scheme, it meets the latest OpenVReg16 (OVR16) specifications.
• The AOZ73104QI is a 4-phase variant that’s compliant with OVR4-22, and it helps safely throttle GPU power for maximum performance.

AOS also introduced several other AI core power solutions:

• The AOZ52986QI Smart Power Stage (SPS), which is compliant with the Intel common footprint spec, provides a compact total solution with high efficiency and enhanced thermal conductivity.
• The new NCP/OCP DrMOS AOZ53228QI product family targets GPU and SoC power in AI compute equipment. The series features accurate NCP and OCP protection, longer peak current durations, and survivability under unreasonable current imbalance conditions.
• The AOZ13058DI Type-C sink and AOZ15953DI Type-C source protection switches support Type-C EPR 3.1 extended power levels for Type-C EPR 3.1 designs up to 240 W. The AOZ13058DI offers overvoltage/overcurrent protection features suited for 48-V Type-C sinking applications, while the AOZ15953DI provides the additional protection features needed for Type-C sourcing applications.

Solutions for AI factory applications included:

• The AONC40202 and AONC68816 MOSFET solutions in state-of-the-art double-sided cooling packages are aimed at 48/54-V high-power-density DC-DC applications in intermediate bus converters (IBCs) for AI servers.
• Several SiC MOSFETs that support high-voltage AC-DC conversion, such as the AOM020V120X3 and the AOGT020V120X2Q, deliver high-voltage performance with ultra-low conduction for sidecar configurations and direct single-step conversion from 13.8-kV AC grid input to 800 V DC.
• A GaN FET portfolio supports high-density DC-DC conversion inside server racks for GPUs and other AI accelerators, including the surface-mount, topside-cooled 650-V AOGT035V65GA1 and 100-V AOFG018V10GA1.

AOS also spotlighted industrial power solutions for BLDC motors that are based on its advanced MOSFETs, which offer low losses and high current capability across various power packages and voltages from 30 to 150 V. They ranged from discrete MOSFETs and motor-driver ICs (half-bridge and three-phase) to dual-core motor-control MCUs for sensorless BLDC motors.

Many of the company’s power devices feature its GTPAK packaging, which supports topside cooling with a large, exposed pad on the package top surface.

AOS’s core MCU motor-control products provide a highly integrated solution for driving sensorless or sensored BLDC/PMSM motors, single-phase/three-phase induction motors, and servo motors. For instance, the AOZ6812QI and AOZ6816QI integrate an 8051 core and a motor-control engine (ME). The 8051 core performs parameter configuration and routine processing, while the ME core integrates FOC, MDU, LPF, PID, and SVPWM modules that enable automatic field-oriented control (FOC) calculation or square-wave control.