AI / ML
There are many ways to keep a design cool including heat pipes and vapor chambers
Startup Taps MEMS Cooling to Turn Down the Heat in Electronic Devices
Oct. 19, 2023
Frore Systems takes advantage of MEMS to blur the lines between active and passive cooling technology.
Heat Pipe Design Guidelines for Better Thermal Designs
Aug. 18, 2023
This presentation delves into heat pipes and vapor chambers that might benefit your application.
How to Achieve Higher Power Density and Better Thermal Performance in PSUs
Jan. 3, 2023
Sponsored by Texas Instruments: Shrinking power supplies inevitably leads to problems with heat. However, a multifaceted approach to mitigate these issues, including innovative...
Thermal Interface Materials: Cool Options for Better Power Density
Oct. 17, 2022
Cooling a device using a thermal interface material (TIM) is a good idea but not foolproof. Still, one particularly effective alternative worth pursuing is the phase-change TIM...
Electronic Design Presents Thermal Design for Modern DC/DC Converters
Sept. 13, 2022
TI's Dorian Brillet de Cande provides tips and details for dc/dc converter designers.
More content from Cool Designs
Conformal-Copper Coating Transforms Component into Its Own Heat Spreader
July 11, 2022
For the ultimate in heat spreading, consider plating the entire board and its components with a thin copper layer.
Thermal Management is Critical in Advanced Electronics
March 31, 2022
The latest advanced electronics face many challenges. Not only do they need to be lightweight and rugged, they must also address thermal management and efficiency. We talk to ...
Thermal Management: New Solutions for New Challenges
May 22, 2020
To overcome the heat problems in the cramped interiors of data-center equipment, engineers went a different route and put a new twist on the gap pad.
What’s the Difference Between Heat Pipes and Vapor Chambers?
Oct. 12, 2017
Although both operate on the same basic principles, their manufacturing process and design flexibility are different. In fact, you can think of vapor chambers as large planar ...
Thermal-Designing Your Way to a Cooler High-Performance Tablet
May 18, 2017
In this real-world example, computational-fluid-dynamic software was used to simulate all packaging levels in a system design in order to minimize heat and improve acoustics.
Thermal-Management Design Banks On Advanced Materials/Adhesives
May 30, 2013
Advanced materials and adhesives are often the keys to effective thermal management. This article covers a wide variety of thermal interface materials and explains what design...
Metal in the Board: Meeting the Challenge of Digital Power
May 29, 2013
Today's and tomorrow's miniaturized power packages require thermal and electrical pathways into the board. Here are a number of approaches involving current, thermal, ...
Simple design equations for thermoelectric coolers
Feb. 23, 1998
Thermoelectric coolers (TECs) are versatile temperature control devices. They’re best thought of as solid-state heat pumps in which the direction and rate of heat flow can be ...