The next generation of high-performance CPUs and GPUs targeting the demanding needs of AI and HPC will generate a significant amount of heat, making efficient cooling solutions...
Thermal management is critical for rugged-systems design, where SWaP-C (size, weight, power, and cost) constraints require innovative cooling strategies.
Not only do massive clusters of GPUs require major amounts of power, but also a cooling system that can handle it all. That's where the xAI Colossus steps in.
A unique peel-and-stick thermal sensor works to keep the high-voltage battery packs in EVs from overheating—and potentially from exploding into flames.
Although both operate on the same basic principles, their manufacturing process and design flexibility are different. In fact, you can think of vapor chambers as large planar ...
In this real-world example, computational-fluid-dynamic software was used to simulate all packaging levels in a system design in order to minimize heat and improve acoustics.
Advanced materials and adhesives are often the keys to effective thermal management. This article covers a wide variety of thermal interface materials and explains what design...
Today's and tomorrow's miniaturized power packages require thermal and electrical pathways into the board. Here are a number of approaches involving current, thermal, ...
Thermoelectric coolers (TECs) are versatile temperature control devices. They’re best thought of as solid-state heat pumps in which the direction and rate of heat flow can be ...
