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Memory, Processor, Transceiver Testing Gets Boost

Tektronix has announced several initiatives related to DDR3 logic debug and protocol validation, PCIe and MIPI M-PHY support, and MHL test. In addition, the company has joined the MOST Cooperation.

High-Speed DDR3 Interposer for TLA7000 Logic Analyzers

With respect to memory test, Tektronix announced DDR3 probing solutions using the Tektronix TLA7000 Series Logic Analyzers. With the introduction of a new high-speed DDR3 interposer for the DIMM form factor, the company enables customers to reuse their existing TLA7BBx Modules to acquire address, control, command, and data signals for all DDR3 speeds. The new interposer is the first to use Tektronix SiGe hybrid ASIC technology to provide analog insight at every DDR3 I/O. The new interposers together with a suite of tools from Tektronix partner Nexus Technology provide easy setup and analysis of all DDR3 traffic.

According to Tektronix, to meet the demand for faster and higher memory capacities together with lower power consumption, JEDEC continues to add higher speed grades to the DDR3 standard and is moving toward a new DDR4 specification. With its new interposer architecture, Tektronix said it is setting the stage for support of DDR4 as that standard moves forward into the market.

PCIe, MIPI M-PHY Support

Tektronix also detailed the support it provides to Intel and the PCIe ecosystem in the testing and verification of the new Intel Xeon Processor E5-2600 family. To test the integrated I/O of the E5-2600, Tektronix is fielding its DPO/DSA/MSO70000 Series Oscilloscopes, TLA7SA16 and TLA7SA08 Logic Protocol Analyzer Modules, TLA7000 Series Logic Analyzers, and BERTScope Bit-Error-Rate Testers. Tektronix was involved in the successful testing of more than 100 PCIe 3.0 systems and cards on the E5-2600 family at events worldwide, including Intel Developer’s Forum and PCI-SIG sponsored events.

The Intel development team selected Tektronix as the protocol test vendor for early silicon verification of E5-2600 I/O performance. “Support from the test and measurement community is vital for any new platform, and with PCIe 3.0, it is even more critical as this new technology greatly improves I/O performance and scalability,” said Jim Pappas, Intel director of technology initiatives, in a press release. “Based on our long mutual track record of success and Tektronix’ continued drive to be at the forefront of the industry, Tektronix was the ideal test and measurement supplier for this strategic initiative,” he explained.

MIPI M-PHY Support

For MIPI Alliance M-PHY testing, Tektronix announced a series of options for its DPO/DSA/MSO70000 Oscilloscopes to automate approximately 700 tests. “The availability of comprehensive test solutions is a key component to the successful deployment of MIPI Alliance specifications,” said Joel Huloux, chairman of the board of MIPI Alliance, in a press release. “Tektronix is actively involved in specification development as well as our test investigation, and we appreciate their efforts to advance MIPI specifications,” he noted.

The integrated Tektronix M-PHY solution includes the addition of power spectral density measurements built into the oscilloscope that eliminates the need for an external spectrum analyzer for transmitter testing. And integrated M-PHY error detection provides a bit-error-rate tester for receiver testing, further reducing equipment expense and setup time.

Tektronix also announced an automated test solution for the Mobile High-Definition Link (MHL) Compliance Test Specification (CTS) 1.2, developed by the MHL Consortium. The solution, based on the DPO/DSA/MSO70000 Series Oscilloscopes, covers transmitter, receiver, and dongle testing for the PHY and protocol layers. The MHL specification defines a high-definition video and digital audio interface for connecting mobile phones and portable devices to HDTVs and other home-entertainment products.

Tektronix unveiled a test solution based on the MHL CTS 1.1 in August 2011 and has moved to provide testing support for the latest MHL CTS 1.2 specification update released on March 2, 2012.

Tektronix also announced its membership in the MOST Cooperation, which promulgates the de-facto Media Oriented Systems Transport standard for multimedia and infotainment networking in the automotive industry. The MOST membership enables Tektronix to develop tailored and accredited test solutions for industrial customers. Tektronix oscilloscopes already offer PHY layer test, hardware-based triggers, and decoding for automotive specific buses like CAN, LIN, and FlexRay.

For More Information

Nexus Technology


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