MatriX Presents Inline X-ray and CT Systems to U.S. Market

Feb. 22, 2013
2 min read

February 22, 2013; San Diego, CA. Having first launched its X3 inline inspection system in Europe in November 2011, Munich-based MatriX Technologies this week introduced its inline inspection systems to the U.S. market at IPC APEX EXPO. The company also highlighted a new system—the XCT-1000S—in its CT portfolio.

The company's new 3-D AXI platform is currently available in three configurations: the X3 universal standard 3-D system, the X3+ with a triple detector setup for high throughput requirements, and—new for 2013—the X3L, which employs a high-speed line-camera technique in combination with selective 3-D capability using a high-resolution digital flat panel.

The company's 3-D X-ray technology targets double-sided solder-joint inspection on PCB assemblies as well as critical and hidden solder-joint connections. Each system is equipped with a a newly developed 3D-SART (Simultaneous Algebraic Reconstruction Technique), which provides slice imaging for high-quality solder-joint analysis.

The MatriX systems target SMT hidden solder joints—especially BGA head-in-pillow defects and QFN-component cold-solder-joint analysis. The systems can also handle thermal-pad inspection and PTH/THT barrel-fill measurements in accordance with IPC-160 requirements. The systems combine multiple inspection modes, including transmission, off-acis image capture, and 3D SART. X3 Series systems use the MIPs (Maximum Intensity Projections) platform with links to MIPs software modules for programming.

The company's new flexible XCT-1000S, with fully automated load/unload capability, has been designed for high-speed CT analysis of electronic components within seconds. The system uses a flat-panel detector with high resolution and optimized image capture times as well as a Siemens-CERA reconstruction algorithm integrated into a MIPs_CT process. With this approach, reconstruction and slice-image analysis processing occurs simultaneously. In addition, up to six objects can be measured in parallel.

www.m-xt.com

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