April 18, 2013. Ascentech LLC, North American distributor for UK-based Aprotec Instrumentation, has announced the availability of the Aprotec Z-Check family of solder paste inspection and measurement systems. Z-Check systems are easy-to-use bench-top noncontact SPI measuring systems capable of meeting the needs of today’s demanding PCB production and assembly environment.
From the innovative Z-Check 3D through to the entry level Z-Check 100, the entire range has been designed to provide accurate pad-specific measurement of solder-paste deposits, adhesives, and component placement.
The Z-Check 3D system is the latest addition to the Z-Check family. It provides a large scanning area and five-line LED scanning.
The Z-Check 900S, the top of the range 2D system, employs a large capacity motorized stage with “teach and learn” positioning software, laser pointer as standard, and automatic z-axis measurement.
The Z-Check 600/600S features greater measurement capacity, utilizing Aprotec’s Maglok table, integrated controls, automatic z-axis measurement, and a laser pointer option.
The Z-Check 100 offers a low-cost solution to PCB quality control with automatic z-axis measurement using a manually positioned friction free glide stage.
The Z-Check CP50 co-planetary inspection system provides the means by which visual inspection and accurate assessment of an IC package can reduce or eliminate the risk of dry jointing or component failure.
In addition to the measurement of rectangular and square pads, all 2D Z-Check systems can assess the geometric properties of angles, circles, and irregular shapes.