July 12, 2013. Nordson YESTECH showcased its latest generation M1m AOI system July 9-11 at SEMICON West. Nordson YESTECH’s M1m is designed for automated inspection of advanced microelectronics and semiconductor packages with specific inspection algorithms for wire/wire bond-inspection (for presence, quality, and position), high-accuracy die inspection, surface finish inspection (for contamination, scratches, and chip-outs), epoxy under-fill, paste/epoxy squeeze-out and bridging, and material dimensional inspection.
Nordson YESTECH’s advanced megapixel color technology offers high-speed device inspection within a footprint less than one square meter. The M1m can be put in-line or off-line with an optional magazine loader/unloader. The M1m can be put in-line with wire bonders or off-line to support several.
Programming the M1m is fast and intuitive. With CAD data input, a complete recipe can be completed in less than one hour. The offline programming option allows the engineer to create complete recipes at any remote location, without affecting production. The M1m also provides SPC data, defect reports, offline defect classification, offline rework capability, and even archived images of every device inspected. In addition, Nordson YESTECH also provides free software upgrades for the life of the system.