Technology breakthroughs featured at SEMICON West

June 26, 2014. The latest manufacturing, materials, and production developments for emerging and adjacent markets will be featured at SEMICON West 2014, to be held on July 8-10 at the Moscone Center in San Francisco. The co-location of emerging and adjacent market-focused exhibitors and technical presentations within the framework of SEMICON West maximizes the synergies between semiconductors and related markets, as each shares many of the same manufacturing materials, equipment, and processes. Over 200 exhibitors and 20 hours of technical presentations will focus on these emerging and adjacent markets, with leading manufacturers, experts and scientists presenting the latest, and answering the question “What comes next?”

SEMICON West will include these emerging and adjacent technology sessions:

  • Next Generation MEMS—The expanding range of mobile devices, wearables, and smart objects in the Internet of Things (IoT)  has increased demand for smaller, smarter, lower power devices—developments that have stimulated a recent surge of innovation in MEMS technologies.  Speakers from GE Global Research, NIST, Qualcomm Ventures, Silex Microsystems, Si-Ware, SolMateS, and Yole Développement will address the latest trends and developments.
  • Bringing Silicon Photonics to Market—As the increase of connected technologies and growth of big data demand increasing bandwidth and transmission speeds, data centers are turning to photons instead of electrons to send data faster between servers, requiring high-speed photonic connections between chips. But developing volume manufacturing technology for connecting optics to electronics is complicated, yet critical for wide adoption. This session features experts in photonics from the industry leaders, including Aurrion, Cisco Systems, CEA-Leti, Compass EOS, IBM, Luxtera, and Oracle.
  • Breakthrough Research Technologies—Accelerating technology advances increasingly involve not only players in the industry supply chain but university and research institutions. This session showcases the latest innovations and research from collaborative efforts of universities, industries, and consortiums.  Hear from Arizona State University, Georgia Institute of Technology, Lam Research (joint project with KU Leuven and imec), Oregon State University, Tokyo Electron (in collaboration with Illinois, Iowa, Michigan, Tohoku, and Keio Universities), and University of Washington.
  • 3D Printing:  Science Fiction or the Next Industrial Revolution—Industry experts explore how 3D printing can benefit manufacturers and how it will impact the 3D printing supply chain. Speakers represent Lawrence Livermore National Labs, Microfabrica, Protocafe, Rabbit Proto, and Semico Research.
  • Flexible Hybrid Electronics for Wearable Applications: Challenges and Solutions—This session, presented by SEMI’s partner FlexTech Alliance,  explores next-generation packaging technologies of flexible hybrid electronics (FHE) that combine the high-performance of conventional silicon semiconductors with the innovations in low-cost, flexible packaging from the emerging printed electronics sector.  Speakers from American Semiconductor, Applied Materials, FlexTech Alliance, MonolithIC 3D, Northfield Automation Systems, PARC, Qualcomm, Soligie, Terepac, and more will examine the latest developments.
  • Disruptive Compound Semiconductor Technologies—The huge potential for both wide- and narrow-bandgap compound semiconductor devices will depend on the development of cost-effective volume manufacturing technology. In this session, speakers from Fraunhofer IZM, KLA-Tencor, Qualcomm, SEMI, Texas Instruments, Transphorm, TriQuint, U.S. Department of Energy, and Yole Développement present.
  • Semiconductor Technology Symposium—Many sessions address the key issues driving the future of semiconductor manufacturing and markets.

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