SEMI reports first quarter 2015 worldwide equipment figures

June 12, 2015

San Jose, CA. SEMI, the global industry association for companies that supply manufacturing technology and materials to the world’s chip makers, has reported that worldwide semiconductor manufacturing equipment billings reached $9.52 billion in the first quarter of 2015. The billings figure is 7% higher than the fourth quarter of 2014 and 6% lower than the same quarter a year ago. The data is gathered jointly with the Semiconductor Equipment Association of Japan (SEAJ) from over 100 global equipment companies that provide data on a monthly basis.

Worldwide semiconductor equipment bookings were $9.66 billion in the first quarter of 2015. The figure is 2% lower than the same quarter a year ago and 3% lower than the bookings figure for the fourth quarter of 2014.

The quarterly billings data by region in billions of U.S. dollars, quarter-over-quarter growth and year-over-year rates by region are as follows:

Region

1Q2015

4Q2014

1Q2014

1Q15/4Q14

(Q-o-Q)

1Q15/1Q14

(Y-o-Y)

Korea

2.69

2.09

2.03

29%

33%

Taiwan

1.81

2.03

2.59

-11%

-30%

North America

1.47

1.83

1.85

-19%

-20%

Japan

1.26

1.11

0.96

13%

31%

China

1.17

0.68

1.71

73%

-32%

Europe

0.69

0.58

0.58

19%

19%

Rest of World

0.43

0.59

0.42

-27%

1%

Total

9.52

8.91

10.15

7%

-6%

Source: SEMI/SEAJ June 2015; Note: Figures may not add due to rounding.

The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports: the monthly SEMI Book-to-Bill Report, which offers an early perspective of the trends in the equipment market; the monthly Worldwide Semiconductor Equipment Market Statistics (SEMS), a detailed report of semiconductor equipment bookings and billings for seven regions and over 22 market segments; and the SEMI Semiconductor Equipment Consensus Forecast, which provides an outlook for the semiconductor equipment market.

About the Author

Rick Nelson | Contributing Editor

Rick is currently Contributing Technical Editor. He was Executive Editor for EE in 2011-2018. Previously he served on several publications, including EDN and Vision Systems Design, and has received awards for signed editorials from the American Society of Business Publication Editors. He began as a design engineer at General Electric and Litton Industries and earned a BSEE degree from Penn State.

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