IPC updates specification for PCB base materials
Bannockburn, IL. IPC-Association Connecting Electronics Industries has released IPC-4101D-WAM1, an amendment to IPC-4101D, “Specification for Base Materials for Rigid and Multilayer Printed Boards.” This newly revised standard delivers trending information for base materials used for rigid and multilayer printed boards.
In particular, this standard provides key updates for board designers, specifiers of board materials, fabricators, and OEMs who use and keep boards current with base materials used in PCBs. This revision goes further to cover requirements for laminate or prepreg base materials primarily used for rigid and multilayer printed boards for electrical and electronic circuits.
“The incorporation of Amendment 1 into IPC-4101D removes the concerns with using revision D of IPC-4101 for all laminates and related prepregs in the fabrication of bare printed boards,” said Tom Newton, director of materials at IPC. “This amendment also clarifies the use of earlier revisions when required by customer specification or contract.”
On top of that, IPC-4101D-WAM1 contains 64 individual, keyword searchable specification sheets, including a brand new sheet that expands offerings for commercially available laminates and prepregs. The standard also adds table 3-10, “Permissible Laminate Substitutions for Specification Sheets /21, /24, /26 and /30.”
IPC-4101D-WAM1 is available for purchase in the IPC book store. The price is $71 for IPC members and $141 for nonmembers. For more information, visit www.ipc.org/4101D-WAM1.
About the Author
Rick NelsonRick Nelson
Contributing Editor
Rick Nelson is a technical journalist who has served as executive editor of Test & Measurement World, chief editor of EDN, and executive editor of EE-Evaluation Engineering. He has also contributed to publications including Vision Systems Design and Electronic Design, and he has participated in many live panel discussions and webcasts. Rick has also held systems-engineering and product-development positions at General Electric and Litton Industries. He received his B.S.E.E. degree from The Pennsylvania State University.
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