GOEPEL electronic has announced the availability of boundary-scan integration into SPEA’s multicore ICT (in-circuit-test) platform. With the level of integration provided for the SPEA 3030 ICT system, execution of interactive boundary-scan tests is now possible on all cores of the ICT (up to four). This integration results in maximization of parallelism and productivity.

Implementation in the multicore system now offers even higher throughput for the test process. Parallel work and simultaneous execution of different test sequences opens up technological and economic advantages. Various types of projects including parallel test of several UUTs can be handled easily.

The boundary-scan integration option from GOEPEL has been available in selected in-circuit test systems from SPEA for several years. The boundary-scan hardware architecture has been integrated into the ICT adapter system with the CASCON system software. The combination of ICT and boundary-scan test procedures makes for the highest test coverage possible.

The new integration enables real parallel test execution involving all resources of the SPEA 3030 ICT system. The LEONARDO SPEA software initializes the tests of the CASCON boundary-scan software, which is able to activate measurement and driver instruments of the ICT system—thereby achieving a real interaction between boundary scan and the individual ICT cores. CASCON then transfers the test results to the SPEA software and assigns them to the respective cores.

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