Karlsruhe, Germany. The MOST Cooperation, the standardization organization for the automotive multimedia-network-technology Media Oriented Systems Transport (MOST), welcomes carmakers, suppliers, and academics to join the 16th MOST Interconnectivity Conference Asia (ICA) on November 12, 2015, in Tokyo.
“Today, more than 180 car models on the road rely on MOST technology as the backbone of their infotainment and multimedia network,” stated Dr. Wolfgang Bott, technical coordinator of the MOST Cooperation. “We look forward to an exciting one-day conference packed with informative presentations. Industry leaders will give an overview of leading-edge developments, designs, applications, and research for this automotive networking standard.”
In the exhibition area, MOSTCO and member companies will display the latest and future MOST150 designs and applications, including the recently introduced Audi Q7 with MOST150 inside.
During the morning session, members of the MOSTCO Steering Committee will give a summary of the successful work of the MOST Cooperation and its member companies. This will be followed by various member presentations.
ETAS will introduce investigations in how to integrate MOST into AUTOSAR, enabling AUTOSAR systems and conventional MOST systems to work seamlessly together in a vehicle network.
K2L will discuss specific test and simulation solutions for MOST streaming devices, solving the growing complexity of development processes and thus presenting a solution for increased speed through the development and test cycle for audio/video-based MOST infotainment systems.
MOSTCO representatives will present the recent developments regarding MOST150 coax physical layer. Similar to the optical solution, it also enables IP data communication, providing an automotive-ready Ethernet channel according to IEEE 802.3 with freely configurable bandwidth from 0 to nearly 150 Mbit/s.
Microchip will demonstrate lean and easy ways for OEMs and tier 1 suppliers to adopt MOST technology. Additional presentations will cover MEMS digital microphones, physical layer aspects, and compliance testing.
