Keysight expands AXIe signal-processing capability

Santa Rosa, CA. Keysight Technologies today introduced an enhanced signal-processing configuration for its M9703B 12-bit AXIe high-speed digitizer/wideband digital receiver. System architects and engineers can use this new bundle option, which is suitable for OEM and aerospace and defense applications, as a component of a larger system requiring extensive FPGA capabilities and a high number of customizable real-time I/O interfaces.

The M9703B-B01 bundle comes pre-configured with the following available options:

  • 1-GS/s sampling rate (-SR1),
  • input frequency of DC to 650 MHz (-F05),
  • large FPGA (-SX3),
  • large acquisition memory (-M16),
  • triggered simultaneous acquisition and readout (-TSR),
  • custom firmware capability (-FDK), and
  • new IO-EXT interposer mezzanine providing a total of 192 input/output (I/Os).

The U5340A FPGA development kit, a standalone software package, allows system architects and engineers to implement their own complex algorithm on board the M9703B high-speed digitizer as well as to address the I/O to monitor and control their OEM system.

“Thanks to an unprecedented combination of 192 digital I/Os, eight high-speed, 12-bit analog input channels, and a scalable open FPGA architecture, the new M9703B-B01 product provides the most versatile and customizable AXIe digitizer platform solution in a compact 1U form factor,” said Pierre-François Maistre, Keysight Communication Measurement Solutions R&D project manager. “By providing wideband solutions that support advanced signal capture, Keysight aims to address more complex challenges in a large variety of aerospace & defense applications that require the treatment of a high amount of data and the control of very large systems.”

The new B01 bundle option is available now for the M9703B AXIe 12-bit high-speed digitizer/wideband digital receiver.

www.keysight.com/find/M9703B

About the Author

Rick Nelson

Rick Nelson

Contributing Editor

Rick Nelson is a technical journalist who has served as executive editor of Test & Measurement World, chief editor of EDN, and executive editor of EE-Evaluation Engineering. He has also contributed to publications including Vision Systems Design and Electronic Design, and he has participated in many live panel discussions and webcasts. Rick has also held systems-engineering and product-development positions at General Electric and Litton Industries. He received his B.S.E.E. degree from The Pennsylvania State University.

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