Sensor and connectivity solutions help transform patient care

Nov. 18, 2015

Düsseldorf, Germany. TE Connectivity (TE) announced today it is showcasing its broad range of products and capabilities at COMPAMED, a leading trade event for suppliers of medical technology. The event takes place November 16-19 in conjunction with MEDICA, one of the world’s largest medical trade fairs.

TE is showcasing a broad range of products, including sensors, fine-wire cable assemblies, catheters and guide wires, laser processing, extrusions and tubing, medical balloons, and testing capabilities. Experts are onsite to discuss and demonstrate the company’s latest innovations for interventional, surgical, imaging, patient monitoring, and diagnostic applications.

“We have a strong history of driving innovation to advance the medical device industry,” said Brian Cunkelman, vice president and general manager, TE Medical. “This unique forum is ideal as our engineers work closely with device manufacturers to provide custom solutions and transform patient care.”

“Electronic systems in medical equipment, devices, and probes rely on sensor signals as a basis for control activities, accurate diagnosis, and treatment,” added Armin Wellhoefer, TE’s global leader for medical sensors. “We offer a wide range of sensor types, including temperature, piezo film, force, and pressure. Our sensors are used for the diagnosis or treatment of many pathologies including heart disease and diabetes.”

TE Sensor Solutions designs and manufactures sensors to exacting specifications, with ISO 13485 certification and FDA registration for various products. TE engineers provide full support of application-specific, standard, and custom requirements, from product concept through manufacturing.

Designed to showcase high tech solutions for medical technology, COMPAMED is the leading annual trade fair for the medical device and manufacturing industries. In 2014, MEDICA and COMPAMED welcomed 130,000 visitors, with approximately 17,000 of whom were particularly interested in the topics covered by COMPAMED.

http://www.te.com/compamed

About the Author

Rick Nelson | Contributing Editor

Rick is currently Contributing Technical Editor. He was Executive Editor for EE in 2011-2018. Previously he served on several publications, including EDN and Vision Systems Design, and has received awards for signed editorials from the American Society of Business Publication Editors. He began as a design engineer at General Electric and Litton Industries and earned a BSEE degree from Penn State.

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