Tektronix and TE SubCom partner on optical modulation analysis

Jan. 10, 2016

Beaverton, OR, and Eatontown, NJ. Tektronix  announced that TE SubCom, a TE Connectivity Ltd. company and an industry pioneer in undersea communications technology, will be deploying the industry’s first commercially available 70-GHz oscilloscopes using Tektronix patented Asynchronous Time Interleaving (ATI) technology in a coherent optical evaluation program designed to increase throughput of the world’s fastest optical submarine network systems. For TE SubCom’s engineers working in the fields of optical modulation analysis and advanced research, these new DPO70000SX low-profile oscilloscopes provide a scalable multi-unit configuration for ultra-high frequency signal fidelity needed in optical submarine network designs.

With optical speeds already in the 100s of Gb/s range and research efforts working to achieve Tb/s speeds, optical communications design is one of the main applications demanding higher-speed test and measurement instrumentation solutions, including the ability to synchronize multiple high-performance oscilloscopes.

Taking advantage of the latest IBM 9HP SiGe process combined with ATI technology, the new DPO70000SX 70GHz oscilloscopes provide a superior method of extending real time oscilloscope bandwidth while maintaining the highest signal fidelity and lowest noise level.

“The race to deploy faster optical communications systems starts with companies like TE SubCom,” said Brian Reich, general manager, Performance Oscilloscopes, Tektronix. “With our new oscilloscopes and ATI technology, Tektronix is happy to help move the industry forward with such a solid partner.”

TE SubCom submarine network evolution

To meet growing bandwidth needs, TE SubCom is-investing in new technologies that can grow network capacity. “Our System Research team continues to push the limits on the transmission capacity per optical channel and the total capacity on transoceanic length cables—this body of work requires state-of-the-art laboratory equipment that has very large electrical bandwidth,” said Neal Bergano, vice president of R&D and CTO of TE SubCom. “The partnership with Tektronix has enabled us to validate these new schemes with confidence.”

www.SubCom.com

www.TE.com

www.tektronix.com

About the Author

Rick Nelson | Contributing Editor

Rick is currently Contributing Technical Editor. He was Executive Editor for EE in 2011-2018. Previously he served on several publications, including EDN and Vision Systems Design, and has received awards for signed editorials from the American Society of Business Publication Editors. He began as a design engineer at General Electric and Litton Industries and earned a BSEE degree from Penn State.

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