San Jose, CA. Presto Engineering Inc. announced today that it has significantly expanded its turnkey capabilities with the opening of two new manufacturing hubs and a world-wide logistics center in Asia.
As an outcome of its partnership with Inside Secure, announced April 2015, Presto Engineering is taking on the facilities in Asia, adding footprint, significant expertise, and a new, enhanced suite of services for Presto’s customers. Presto Engineering now offers a turn-key product engineering and production management solution for integrated circuits (IC), from GDSII hand-off (design output) to finished ICs shipped directly to end customers, targeted at the latest in high-speed communication, Internet of Things (IoT), and secured elements markets.
“This expansion provides the local production capacity and hands-on expertise that we need in Asia to offer our customers a fast, secure, cost-effective, and comprehensive production solution,” stated Michel Villemain, CEO, Presto Engineering. “We now have fully-trained staff and substantial local capacity with our own test equipment in place in Asia. This both strengthens and complements our capabilities in the U.S. and Europe, enabling us to provide responsive, on-site and in-region technical support for optimum visibility on customer projects, where and when it counts.”
Jon Lanson, Presto’s vice president of worldwide sales and marketing, added, “There is no doubt that security is a major concern in the IoT market. Building a hardware-based secure solution, like what’s done in the payment world, is one of the leading IoT security approaches. With Presto’s new secure capabilities in Europe and Asia, we are ready to address this manufacturing issue now, by either assisting clients with developing their own specific solution, or executing an existing turnkey process.”
The new operations are located in Bangkok, Thailand; Kaohsiung, Taiwan; and Hong-Kong, SAR. To Presto’s existing capacity in the US and Europe, they add 20+ probe test cells, advanced die prep capabilities, and payment module manufacturing in secured (EAL5+/EAL6) floors, ready to support large projects with unit volumes of 10 million or more.