remont, CA. SAKI America will demonstrate its 3rd generation 3D automated optical inspection system at IPC APEX Expo 2016, booth 1860. Saki’s new BF-3Di-Z1 accommodates XXL board sizes, offers dual-lane configurations, includes optional side-angle cameras, and increases throughput by 15%. The 3D AOI system provides measurement of components with a height range from 0 to 20 mm, achieving 1-micron height resolution, a false call rate of <100 ppm with zero escapes, and a positioning system 50% faster than Saki’s previous 3D machine. The camera and lighting systems capture clear, detailed images with no shadowing for inspection of the most difficult defects, such as lifted leads, tombstones, reversed polarity, and height variations.
Saki will also demonstrate its 3D automated solder-paste inspection system, which uses both a 2D and 3D LCoS imaging system and offers closed-loop process functionality, pad-based warpage compensation, and measurement performance specifically optimized for printed solder paste.
“Saki is the industry innovator that revolutionized 2D line-scan AOI over 21 years ago,” said Satoshi Otake, general manager, SAKI America. “We offer a complete 3D lineup of SPI, AOI, and AXI with systems installed globally. All Saki’s 3D systems share the same software and graphical user interface for easier programming and operation. Saki’s technical experts will be available at IPC APEX booth 1860 to answer your inspection questions. Contact our technical experts to arrange an appointment or stop by the booth to discuss how we can meet your inspection needs and challenges.”
IPC APEX Expo is being held in Las Vegas, NV, March 14-16, 2016.
