San Jose, CA. ADLINK Technology has announced the release of four embedded computing solutions designed with the Intel Atom x5-E8000 processor. Built with 14-nm technology, the Intel Atom processor boosts performance and reduces power consumption for mobility, medical, and industrial-automation applications. The newly updated COM Express cExpress-BW, SMARC LEC-BW, and Qseven Q7-BW modules as well as the AmITX-BW-I thin Mini-ITX embedded board now offer better cost-performance ratios as a result of improved computing capability.
The latest Intel Atom SoC, released in Q1 2016, features 64-bit quad-core processing that is suitable for multitasking applications. The processor offers a configurable TDP (cTDP) of only 5 W at 1.04 GHz, enabled by its 14-nm core transistors. With the new processor, ADLINK embedded boards and modules also support up to 8 GB of dual channel DDR3L 1,600-MHz memory and up to three independent displays with Intel HD graphics.
“ADLINK is committed to building the Internet of Things with products that offer exceptional value and performance,” said Henk van Bremen, senior director of ADLINK Module Computing Product Segment. “Our latest embedded solutions provide the most efficient design options for low-power yet graphic-intense edge applications, such as mobile tablets, medical carts, and infotainment kiosks.”
The new COM modules and Mini-ITX board run graphics processing on a base frequency of 320 MHz with eDP/DP/HDMI interfaces for up to three display ports, an increase in the number of ports over previous COM Express modules. In addition to 4K resolution, Intel Gen9 Iris Graphics offer 2D/3D hardware acceleration with decoding support for HEVC H.265, MPEG2, MVC, VC-1, WMV9, JPEG, and VP8 and with encoding support for HEVC H.265, MVC, and JPEG. Graphics support also includes Open GL for graphics rendering, Intel Quick Sync Video for fast conversion to mobile format, and Intel clear Video HD Technology for better quality video.
With faster I/O processing and a rich selection of I/O features, ADLINK’s latest computer-on-modules satisfy the requirements for a wide range of applications. The cExpress-BW COM Express Compact Size Type 6 module offers four USB 3.0 ports, an increase over the two ports in the previous model. All new modules offer three or more USB 2.0 ports, three single-lane PCIe expansion slots, and two SATA 6-Gb/s interfaces. The AmITX-BW-I board features high connectivity with four USB 3.0 and four USB 2.0 ports, HDMI, and one single-lane and one Mini PCIe slot. With its thin Mini-ITX form factor, this embedded board serves as a space-saving solution for infotainment, industrial, and medical applications. The Q7-BW Qseven Standard Size module and LEC-BW SMARC Short Size module each offer support for two MIPI camera serial interfaces, making them ideal for stand-alone image-capture edge applications.
ADLINK embedded boards and modules are equipped with ADLINK’s Smart Embedded Management Agent (SEMA) to provide detailed system data at the device level, including temperature, voltage, power consumption, and other key information. Access to system activities allows operators to identify inefficiencies and malfunctions in real-time, thus preventing failures and minimizing downtime. ADLINK’s SEMA-equipped devices connect seamlessly to the SEMA Cloud to enable remote monitoring. All collected data, including sensor measurements and management commands, are accessible from any place, at any time through an encrypted connection.
