Hirose opens North American headquarters near Chicago

Chicago, IL. Hirose, a developer of connector products, has relocated its North American headquarters to Downers Grove, IL, a suburb of Chicago. The new centrally located headquarters aligns with Hirose’s long-term strategy to achieve sustainable growth in the North American market.

The Chicago headquarters is home to a customer service and technology support center that strengthens Hirose’s capability to meet customers’ critical requirements for high-quality interconnect solutions. With the new Chicago-based facility, Hirose continues to invest in its customer services and technical programs that lay the foundation for future growth and success.

The customer service and technology support center includes Hirose’s interconnect technology group. With a staff of highly trained engineers and sales professionals, Hirose’s interconnect technology group simplifies the design and purchasing process for customers and channel partners.

Many of Hirose’s North American segment managers and market analysis groups are also located at the new North American headquarters in Chicago. These groups work cohesively with Hirose’s regional offices in San Jose and Detroit to provide leadership, best practices, research and development, and training. By integrating sales, service and support, Hirose is dedicated to enriching the customer experience by simplifying the design cycle and satisfying the needs of customers.

Hirose serves design engineers and buyers by designing and delivering innovative interconnect solutions for specific OEM applications. Hirose’s broad interconnect offering includes advanced solutions for markets including automotive, consumer, data center, home appliance, industrial, lighting, medical, smart grid, telecom, test and measurement, and transportation.

https://www.hirose.com/us/

About the Author

Rick Nelson

Rick Nelson

Contributing Editor

Rick Nelson is a technical journalist who has served as executive editor of Test & Measurement World, chief editor of EDN, and executive editor of EE-Evaluation Engineering. He has also contributed to publications including Vision Systems Design and Electronic Design, and he has participated in many live panel discussions and webcasts. Rick has also held systems-engineering and product-development positions at General Electric and Litton Industries. He received his B.S.E.E. degree from The Pennsylvania State University.

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