Rudolph adds 3D metrology for advanced packaging process control

April 7, 2016

Wilmington, MA. Rudolph Technologies Inc. announced the availability of new, high-speed 3D metrology on its flagship NSX Series, a highly-flexible inspection and measurement platform for process development and control of die-level interconnects. Already in use by multiple customers worldwide, the NSX Series with high-speed 3D metrology is capable of both high-volume production monitoring and advanced process development.

“The new capability provides a 200 to 400% throughput improvement over our previous Wafer Scanner bump metrology system, and when paired with our Discover Software, provides a complete coplanarity solution for our customers,” said Scott Balak, Rudolph’s director, inspection product management. “With the increasing number of new packaging technologies being developed by foundries, outsourced assembly and test (OSAT) manufacturers, and integrated device manufacturers (IDMs), the flexibility and reliability of this new capability on the trusted NSX Series platform is especially valuable to customers seeking to move rapidly from pilot lines to production.”

Data is collected in seconds from millions of bumps and then analyzed by Rudolph’s Discover Software analysis database. Engineers gain unique insight into critical metrology applications, from both an individual bump point of view or holistically as a wafer, as part of a simultaneous product and process control solution.

“Manufacturers are looking for a more comprehensive and flexible process control solution that provides, not only inspection or bump data, but also usable analytical information about their processes,” said Mike Goodrich, vice president and general manager of Rudolph’s Process Control Group. “Our powerful Discover analysis software provides insight into the process that is otherwise unavailable to process control tool owners. The high-speed 3D bump metrology capability incorporates a three-segment optical range, giving our customers the flexibility to control both smaller micro bumps and larger traditional solder bumps with a single inspection and metrology platform. When combined with Rudolph’s advanced automation capability, customers can measure thin and warped wafers without the extra expense of frame and tape mounting.”

Goodrich concluded, “We understand the importance of 3DIC and next-generation packaging processes and we have aggressively pursued development of this comprehensive 3D coplanarity solution to meet our customers’ needs for a cost efficient, multi-functional process control tool.”

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