Pickering Interfaces debuts high-density 2-A PXI relay module

May 6, 2016

Clacton-on-Sea, UK. Pickering Interfaces, a provider of modular signal switching and simulation for electronic test and verification, has announced the launch of a new high-density 2-A PXI relay module.

The new module (Model 40-100), configured with 83 SPDT relays, was originally designed for applications in aerospace and defense requiring a higher density 2-A alternative to Pickering’s current 52 SPDT module (Model 40-139). This new relay module is suitable for applications requiring medium-power switching with very high density. It features a 2-A current capacity and voltages to 200 VDC/140 VAC.

Connections for the 40-100 high-density relay module are made via a front panel mounted 500-pin SEARAY high-density connector. Pickering also offers standard cabling solutions converting from this high-density connector to more standard interfaces such as D connectors and IDC connectors as well as an unterminated option for ease of use.

Typical uses are found in automotive, aerospace, military, and power-cell testing applications.

Pickering Interfaces stands behind all of its manufactured switching and simulation products with a standard three-year warranty and guaranteed long-term product support.

Pickering Interfaces designs and manufactures modular signal switching and simulation for use in electronic test and verification. It offers a range of switching cards for PXI, LXI, PCI, and GPIB applications as well as a range of supporting cables and connectors.

Pickering Interfaces operates globally with direct operations in the United States, UK, Germany, Sweden, France, Czech Republic, and China, together with additional representation in countries throughout the Americas, Europe, and Asia. The company currently serves the automotive, aerospace and defense, power generation, energy, and commercial electronics industries.

www.pickeringtest.com

About the Author

Rick Nelson | Contributing Editor

Rick is currently Contributing Technical Editor. He was Executive Editor for EE in 2011-2018. Previously he served on several publications, including EDN and Vision Systems Design, and has received awards for signed editorials from the American Society of Business Publication Editors. He began as a design engineer at General Electric and Litton Industries and earned a BSEE degree from Penn State.

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