Test Vision 2020 topics to span advanced packaging to test data
Test Vision 2020 takes place July 13-14 in San Francisco in conjunction with SEMICON West. The goal is to look at where the test industry is heading and to provide a forum for discussing directions and solutions.
Jan Vardaman, president and founder of TechSearch International Inc., will deliver a Wednesday keynote address “Advanced Packaging Trends and the Impact on Test.” Wednesday technical papers will address the future of analog test as well as advanced packaging and advanced test challenges. A panel session will let participants weigh in on the topic “3D/2.5D/SIP: What should be tested, who should do it, and where?” The Wednesday program will conclude with a poster session and reception.
Thursday will feature two invited speakers. Professor Thomas Lee, Stanford University, will deliver a talk Thursday morning titled “Silicon is the New Steel: Building the Internet of Everything—the World’s first Terascale Network.” The Thursday afternoon speaker will be Yervant Zorian, chief architect and fellow at Synopsys and president of Synopsys Armenia, who will deliver an address titled “Test & Robustness in Today’s Advanced Technologies.” Thursday technical papers will cover advanced test methods and getting more out of your test data.
For more information and to register, visit http://www.testvision2020.com/
Here are some highlights from last year’s Test Vision 2020:
“Xcerra’s Shelley looks to cut RF test cost for IoT,”
“Test Vision 2020 keynoter addresses IoT and the cloud,” and