Keynoters announced for COMSOL Conference 2016 Boston

Sept. 16, 2016

Burlington, MA. The organizers of COMSOL Conference 2016 Boston have announced this year’s keynote speakers. COMSOL conferences are held worldwide in seven major cities, attracting thousands of engineers and scientists with its focus on multiphysics simulation and application design. The first event is taking place in Boston on October 5-7 and features as keynoters the following lineup of distinguished modeling and simulation professionals:

  • Bernard McGarvey, senior engineering adviser at Eli Lilly and Co.;
  • Edward P. Furlani, professor in the Departments of Chemical and Biological Engineering and Electrical Engineering at University at Buffalo SUNY;
  • Carl Meinhart, professor of mechanical engineering at the University of California-Santa Barbara and founder and CEO of Numerical Design Inc.; and
  • Sebastien Perrier, R&D acoustical engineer at Echologics Engineering.

McGarvey’s keynote is titled “Leveraging Modeling and First Principles Thinking to Accelerate Improvement at a Pharmaceutical Company.” He is responsible for process modeling applications at Eli Lilly, where he supports the application of process modeling in both manufacturing and process development. He has 32 years of experience in manufacturing, where he has held positions in process engineering, process control engineering, and technical services. His interests include general mathematical modeling and simulation, process data analysis, capacity/workflow modeling, risk management, fluid dynamics, cold chain container design and qualification, nonlinear model estimation, and quality engineering. He has a B.Eng. degree and a Ph.D. from University College Dublin, Ireland.

Furlani’s keynote is titled “Multiphysics and Multiscale Simulations: Advancing Basic Science and Industrial Applications.” He holds a Ph.D. in theoretical physics and has a joint appointment as a professor in the Departments of Chemical and Biological Engineering and Electrical Engineering at University at Buffalo SUNY. He transitioned to academia in 2011 from the Eastman Kodak Research Labs, where he performed interdisciplinary modeling for the development of commercial materials and devices. His industrial experience spans applications in the fields of microfluidics, photonics, applied magnetics, and microsystems technology. His current research involves the development of computational models to design innovative nano- and microstructured materials and devices with unique functionality. His current research spans the applications of microfluidics, biosensing, energy storage, nanophotonics, and magnetic particles. Professor Furlani’s research contributions include over 100 peer-reviewed publications, a textbook on applied magnetics, and numerous invited conference presentations. He also has a distinguished record of translational research and currently holds 152 U.S. patents.

Meinhart’s keynote is titled “Transport Processes in Microfluidics.” He is a professor of mechanical engineering at the University of California-Santa Barbara. He obtained his Ph.D. from the University of Illinois in 1994. Since coming to UCSB in 1996, his research has focused on developing microfluidic devices and investigating their fundamental transport mechanisms. Professor Meinhart’s research on microfluidics has been cited approximately 7,800 times, with an h-index of 34 (Google Scholar scholarly texts search). He has seven issued patents. In addition to being a professor at UCSB, Dr. Meinhart is the founder and CEO of Numerical Design, Inc., which is a COMSOL Certified Consultant. Dr. Meinhart is a fellow of the American Physical Society.

Perrier’s keynote is titled “The Effect of Local Resonators on Sound Propagation in Fluid-Filled Pipes.” He is a mechanical engineer who received his Ph.D. from the University of Sherbrooke. He specialized in acoustics and vibrations, coupling of structures, and signal processing. He has been working with Echologics Engineering for two years, applying his expertise to optimize and develop next-generation solutions for buried pipe infrastructure management and leak detection. His work focuses on carrying out laboratory and field tests, developing processes and methods for measuring vibration and pressure events, and pipe modeling.

The COMSOL Conference brings together engineers, researchers, and scientists worldwide throughout seven locations, providing them with the chance to showcase their work, share innovative technologies and best practices, as well as the opportunity to interact with the members of the COMSOL community.

The 2016 conference will feature presentations on simulation apps using the Application Builder and the COMSOL Server product. Other highlights include

  • over 30 hands-on training opportunities to learn how to use COMSOL Multiphysics software for better R&D and design;
  • talks by industry experts on the latest in computational modeling;
  • discussion-oriented focus sessions covering simulation best practices, moderated by COMSOL product managers;
  • The introduction of the newest simulation tools and technologies;
  • User-contributed paper and poster presentations;
  • An exhibition showcasing products offered by COMSOL Certified Consultants, software and hardware providers, and other exhibitors within the CAE industry; and
  • the chance to interact with peers and explore the simulation work of fellow engineers.

Additional conferences this year will take place in Munich (October 12-14), Bangalore (October 20-21), Shanghai (November 3-4), Taipei (November 11), Seoul (November 25), and Tokyo (December 9).

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