Huntingdon Valley, PA. Manncorp has introduced the new 4040 vapor phase soldering system—representing a new generation that allows SMT assemblers to easily and affordably capitalize on this trusted technology’s numerous advantages, including soldering quality, the ability to perform instant product changeovers, and 0% risk of overheating. The system is suitable for manufacturers of high component-mix assemblies with BGAs and other complex SMDs, where uniform soldering temperatures and long-term product reliability are critical, including military, avionics, and medical applications. In addition to serving these applications, the 4040 is taking vapor phase mainstream.
Designed for today’s sustainable manufacturing facility, the compact 4040 installs easily in virtually any workspace, without the need for complex ductwork and external venting. The efficient heat transfer and gentle conditions of the vapor-phase process generate minimal exhaust, which is easily managed by any low-cost, self-contained fume-extraction system. With a power rating of less than 3 kW (75 to 80% less than even the smallest convection ovens), lower electric bills will also contribute to the 4040’s fast payback.
A multi-chamber design and automatic board-handling system make the 4040 easy and economical to operate. The illuminated processing chamber, which includes a large 14″ viewing window, is completely isolated during soldering, and a fluid-recovery system collects and filters condensate during cooldown. Cycle times ranging from six to nine minutes or less and a large (18″ x 16″) work holder allow batch soldering of multiple boards for throughput that easily supports low- to medium-volume production requirements.
Soldering programs can be created automatically in seconds without any danger to boards or components and without time-consuming profiling. Programs can be fine-tuned for increased efficiency and energy savings, if desired, through the use of an included thermocouple connector accessory that allows monitoring of actual board temperature throughout the soldering cycle. Thermal profile data can also be recorded, saved, and exported through the built-in SD card slot for SPC traceability.
