EDI CON and seeking input on RF/microwave, EMC, and high-speed digital design

Sept. 20, 2016

EDI CON USA gets underway in Boston today and continues through Thursday. Organizers say the event “…uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities.”

For EE-Evaluation Engineering’s December print issue, I’ll be writing a feature article on the topics that the event will focus on. If you are an exhibitor at EDI CON, I hope to see you at the show. If we don’t connect, I would appreciate your responses to some of the following questions:

What products and services are you highlighting at EDI CON?
What’s unique about your offerings?
What do you see as the key challenges facing the engineers attending EDI CON?
What synergies do you offer to help engineers contend with RF/microwave, EMC/EMI, and high-speed digital design issues (including signal and power integrity)?

If you are an attendee, what did you learn at the show, and what would you like to see vendors offer in the future?

Please respond by September 30. Send me email at [email protected].

Thanks for your feedback.

About the Author

Rick Nelson

Contributing Editor

Rick Nelson is a technical journalist who has served as executive editor of Test & Measurement World, chief editor of EDN, and executive editor of EE-Evaluation Engineering. He has also contributed to publications including Vision Systems Design and Electronic Design, and he has participated in many live panel discussions and webcasts. Rick has also held systems-engineering and product-development positions at General Electric and Litton Industries. He received his B.S.E.E. degree from The Pennsylvania State University.