EDI CON and seeking input on RF/microwave, EMC, and high-speed digital design

Sept. 20, 2016

EDI CON USA gets underway in Boston today and continues through Thursday. Organizers say the event “…uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities.”

For EE-Evaluation Engineering’s December print issue, I’ll be writing a feature article on the topics that the event will focus on. If you are an exhibitor at EDI CON, I hope to see you at the show. If we don’t connect, I would appreciate your responses to some of the following questions:

What products and services are you highlighting at EDI CON?
What’s unique about your offerings?
What do you see as the key challenges facing the engineers attending EDI CON?
What synergies do you offer to help engineers contend with RF/microwave, EMC/EMI, and high-speed digital design issues (including signal and power integrity)?

If you are an attendee, what did you learn at the show, and what would you like to see vendors offer in the future?

Please respond by September 30. Send me email at [email protected].

Thanks for your feedback.

About the Author

Rick Nelson | Contributing Editor

Rick is currently Contributing Technical Editor. He was Executive Editor for EE in 2011-2018. Previously he served on several publications, including EDN and Vision Systems Design, and has received awards for signed editorials from the American Society of Business Publication Editors. He began as a design engineer at General Electric and Litton Industries and earned a BSEE degree from Penn State.