Flexible hybrid printed electronics pavilion set for IPC APEX EXPO

Sept. 22, 2016

Bannockburn, IL. IPC-Association Connecting Electronics Industries has announced that a new pavilion focusing on flexible hybrid printed electronics will debut at IPC APEX EXPO 2017 February 14-16 in San Diego. The dedicated area will promote flexible hybrid printed electronics and support this growing technology.

The Flexible Hybrid Printed Electronics Pavilion will showcase the growing printed electronics technology sector and how these technologies also apply to hybrid PCBs and PCB assemblies. This will provide IPC APEX EXPO attendees with an opportunity to explore topics and vendors in a centralized location.

In addition to the show floor pavilion, the planned flexible hybrid printed electronics programming will include

technical paper sessions,
a management-focused buzz session, and
standards meetings.

“Flexible hybrid printed electronics is an area of great interest for IPC APEX EXPO attendees,” said Chris Jorgenson, IPC director of technology transfer. “This pavilion on the show floor and the supporting events during the show will provide a valuable opportunity for attendees to network and learn about these trending products and technologies.”

www.IPCAPEXEXPO.org

About the Author

Rick Nelson

Contributing Editor

Rick Nelson is a technical journalist who has served as executive editor of Test & Measurement World, chief editor of EDN, and executive editor of EE-Evaluation Engineering. He has also contributed to publications including Vision Systems Design and Electronic Design, and he has participated in many live panel discussions and webcasts. Rick has also held systems-engineering and product-development positions at General Electric and Litton Industries. He received his B.S.E.E. degree from The Pennsylvania State University.