Pickering to showcase ultra-high density reed relays at electronica

Sept. 26, 2016

2 min read

Pickering High Density Reed Relay Series

Pickering Electronics, a provider of reed relays, will be showcasing its latest high-density range at electronica on November 8-11, 2016, in Munich.

The Pickering Series 115, Series 116, and Series 117 are three ranges of small single-pole reed relays suitable for the construction of high-density matrices or multiplexers.

These three ranges have identical pin configurations allowing a common PCB for all types but allowing the designer a range of switch ratings according to which part is fitted. The reed switches are vertical within the package, which permits a common footprint with a board

Pickering High Density Reed Relay Series 300x223

area of only 3.8 mm x 6.6 mm. Only the profile height changes with the increasing power or current ratings.

The Series 117 has a height of 9.5 mm and is rated at 0.5 A switching at 5 W. The Series 116 has a height of 12.5 mm and is rated at 0.5 A switching at 10 W. The Series 115 has a height of 15.5 mm and is rated up to 1.0 A switching at 20 W. Double-pole versions are also available in the Series 116 and 117.

One benefit of the very small size of these relays is that it often makes it possible to increase the functionality of existing designs without increasing the size of the printed circuit boards.

All feature instrumentation-grade reed switches with sputtered ruthenium contacts, making them suitable for low-level or cold switching applications.

They have the option of an internal diode across the coil connections for back EMF suppression and feature Pickering’s unique SoftCenter construction as well as an internal mu-metal magnetic screen. Mu-metal has the advantage of a high permeability and low magnetic remanence and eliminates problems that would otherwise occur due to magnetic interaction. Relays of this size without magnetic screening would be unsuitable for applications where dense packing is required.

www.pickeringrelay.com

About the Author

Rick Nelson

Contributing Editor

Rick Nelson is a technical journalist who has served as executive editor of Test & Measurement World, chief editor of EDN, and executive editor of EE-Evaluation Engineering. He has also contributed to publications including Vision Systems Design and Electronic Design, and he has participated in many live panel discussions and webcasts. Rick has also held systems-engineering and product-development positions at General Electric and Litton Industries. He received his B.S.E.E. degree from The Pennsylvania State University.