State College, PA. Remcom has announced a new capability to import flexible printed-circuit-board (PCB) designs in the latest update to XFdtd 3D electromagnetic simulation software. The new release also includes dielectric volume averaging and several usability conveniences.
XFdtd’s PCB import dialog now includes the option to wrap a design, such as a flexible circuit, onto a form automatically during the import process. The wrap option conforms the PCB and all of its parts onto the flexible-circuit geometry, eliminating the need to bend the model into the desired shape or manually wrap each layer.
Rodney Korte, product manager for XFdtd, said, “We’re excited to announce this unique capability, which will tremendously streamline geometry setup for all customers working with flexible circuits. We’ve eliminated what was a time-consuming and error-prone process, replacing it with a simple, one-click import option that produces the simulation-ready design in one smooth step. This technology has the potential to transform the device design workflow for engineers in a wide variety of industries, including mobile devices, exercise monitors, automotive instrument panels, and more.”
Another addition in the new release is dielectric volume averaging, which increases simulation accuracy for simulations with high-permittivity materials, such as ceramic chip antennas.
