Marvin Test to feature expanded semiconductor test at ITC 2016

Nov. 10, 2016

Irvine, CA. Marvin Test Solutions announced it will feature its TS-960e semiconductor test platform, the newest addition to the TS-960 Series, at the International Test Conference 2016 (ITC), November 15-17, in Fort Worth, TX.

The TS-960e is a flexible, open-architecture semiconductor test solution that offers PXI Express performance and digital, mixed-signal, and RF test capabilities in a compact, single-chassis footprint. ATEasy test-development and test-executive software provides an easy-to-use integrated software environment to reduce development time.

The TS-960e is now available with Keysight Technologies’ comprehensive range of PXIe RF instrumentation to address a range of RF applications including WLAN, Bluetooth, Cellular, EW, and RF transceivers. Available instrumentation options include vector transceivers, vector signal analyzers and generators, and vector network analyzers offering wafer and packaged RF test capabilities from 9 KHz to 27 GHz. All of these modules as well Keysight’s VSA measurement application software are fully integrated with ATEasy to provide a complete solution.

“Our semiconductor test solutions offer an alternative to expensive, big-iron ATE systems, delivering the features of high-end ATE with the open architecture and benefits of the PXI standard,” said Steve Sargeant, CEO of Marvin Test Solutions. “The TS-960e offers the flexibility to include both PXI and PXIe modules and, with the addition of Keysight’s portfolio of PXIe RF instruments, enables our customers to configure a compact solution with the advanced capabilities they need.”

The TS-960e platform features a 21-slot, 3U PXI Express chassis accommodating up to 256 125-MHz digital I/O channels with PMUs per pin, yet has a small footprint and modular structure, allowing users to address a range of test applications. Available as a benchtop version or with an integrated manipulator, the TS-960e takes full advantage of the PXIe architecture to achieve a full-featured test solution for digital, mixed-signal or RF test applications.

The base TS-960e platform uses the advanced GX5296—a 3U PXI, 32 channel 125-MHz digital I/O card featuring timing and PMU per pin capability with sub-nanosecond edge-placement resolution. The GX5296 delivers high-performance digital test capabilities and is suitable for addressing verification, focused production, and failure analysis test needs—or for replacing legacy test systems. The GX5296 builds on the GX5295 PXI digital subsystem, offering timing, density, memory, and sub-nanosecond timing-per-pin capabilities. And with the addition of MTS’ software tools for program development / debug and comprehensive file conversion tools for WGL, VCD/eVCD, STIL , and ATP formats, the TS-960e provides digital and mixed-signal test capabilities for component, SoC and SiP devices.

ITC, known as the cornerstone of Test Week, is dedicated to the electronic test of devices, boards, and systems, covering the complete cycle from design verification, test, diagnosis, failure analysis, and back to process and design improvement. This year’s event will take place November 15-17 at the Fort Worth Convention Center. Marvin Test Solutions is exhibiting in Booth 311, and will participate in the Corporate Forum with a presentation entitled “Leveraging the PXI Modular Architecture for ATE Platforms.”

www.itctestweek.org

http://www.MarvinTest.com/

About the Author

Rick Nelson | Contributing Editor

Rick is currently Contributing Technical Editor. He was Executive Editor for EE in 2011-2018. Previously he served on several publications, including EDN and Vision Systems Design, and has received awards for signed editorials from the American Society of Business Publication Editors. He began as a design engineer at General Electric and Litton Industries and earned a BSEE degree from Penn State.

Sponsored Recommendations

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!