SEMI reports Q3 worldwide semiconductor equipment figures

Dec. 10, 2016

San Jose, CA. SEMI has reported that worldwide semiconductor manufacturing equipment billings reached $11.0 billion in the third quarter of 2016. The billings figure is 5% higher than the second quarter of 2016 and 14% higher than the same quarter a year ago. The data is gathered jointly with the Semiconductor Equipment Association of Japan (SEAJ) from over 95 global equipment companies that provide data on a monthly basis.

Worldwide semiconductor equipment bookings were $11.3 billion in the third quarter of 2016. The figure is 30% higher than the same quarter a year ago and 5% lower than the bookings figure for the second quarter of 2016.

The quarterly billings data by region in billions of U.S. dollars, quarter-over-quarter growth and year-over-year rates by region are as follows:

 

3Q2016

2Q2016

3Q2015

3Q2016/

2Q2016
(Qtr-over-Qtr)

3Q2016/

3Q2015
(Year-over-Year)

Taiwan

3.46

2.73

2.85

27%

22%

Korea

2.09

1.53

1.56

36%

34%

China

1.43

2.27

1.70

-37%

-16%

Japan

1.29

1.05

1.43

22%

-10%

Rest of World

1.13

1.31

0.58

-14%

95%

North America

1.05

1.20

1.18

-12%

-11%

Europe

0.53

0.37

0.34

42%

57%

Total

10.98

10.46

9.64

5%

14%

Totals may not add due to rounding; Source: SEMI/SEAJ

The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports: the monthly SEMI Book-to-Bill Report, which offers an early perspective of the trends in the equipment market; the monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment bookings and billings for seven regions and over 22 market segments; and the SEMI Semiconductor Equipment Forecast, which provides an outlook for the semiconductor equipment market.

www.semi.org/en/MarketInfo/EquipmentMarket

About the Author

Rick Nelson | Contributing Editor

Rick is currently Contributing Technical Editor. He was Executive Editor for EE in 2011-2018. Previously he served on several publications, including EDN and Vision Systems Design, and has received awards for signed editorials from the American Society of Business Publication Editors. He began as a design engineer at General Electric and Litton Industries and earned a BSEE degree from Penn State.

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