Qualcomm and TDK announce RF360 Holdings joint venture

Feb. 3, 2017

San Diego and Tokyo. Qualcomm Inc. and TDK Corp. today announced the completion of the previously announced joint venture under the name RF360 Holdings Singapore PTE. Ltd. (RF360 Holdings). The joint venture will enable Qualcomm’s RFFE Business Unit to deliver RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as those involving the Internet of Things, automotive applications, and connected computing. The business being transferred constitutes a part of the TDK SAW Business Group activities.

“The ongoing expansion of mobile communication across multiple industries and the unprecedented deployment of multicarrier 4G technologies now reaching over sixty-five 3GPP frequency bands are driving manufacturers of wireless solutions to higher levels of miniaturization, integration, and performance, especially for the RFFE in these devices,” said Cristiano Amon, executive vice president, Qualcomm Technologies Inc. (QTI) and president, Qualcomm CDMA Technologies (QCT). “Further, 5G will increase the level of complexity even more. To that end, the ability to provide the ecosystem a truly complete solution is essential to enabling our customers to deliver mobile solutions at scale and on time.”

Together with RF360 Holdings, QTI will be positioned to design and supply products with end-to-end performance and global scale from the modem/transceiver all the way to the antenna in a fully integrated system.

RF360 Holdings will have a comprehensive set of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW), and bulk acoustic wave (BAW), to support the wide range of frequency bands being deployed in networks across the globe. Moreover, RF360 Holdings will enable the delivery of RFFE modules from QTI that will include front-end components designed and developed by QTI. These components include CMOS, SOI, and GaAs power amplifiers; a portfolio of switches and low noise amplifiers (LNAs); and an envelope tracking solution.

Deepening collaboration between Qualcomm and TDK

In addition to operating the joint venture, Qualcomm and TDK will deepen their technological cooperation to cover a range of cutting-edge technologies for next-generation mobile-communications, IoT, and automotive applications.

“The deeper collaboration with Qualcomm fits perfectly into our growth strategy,” said Shigenao Ishiguro, president and CEO of TDK Corp. “It is a further step that aims to open up new promising business opportunities for TDK, while strengthening the company’s innovativeness and thus competitiveness in such attractive future markets as sensors, MEMS, wireless charging, and batteries. Our customers will clearly benefit from the resulting unique and comprehensive technologies and products portfolio.”

You can download more information from Tokyo Stock Exchange disclosure document.

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