Waterbury, CT. MacDermid Enthone Electronics Solutions has announced the release of the Affinity ENIG 2.0 process, a high-reliability, low-variation electroless-nickel immersion-gold plating process. Affinity ENIG 2.0 meets stringent reliability requirements while also providing cost benefits to its customers, the company said, adding that the process conforms to IPC 4552.
MacDermid Enthone says the new process evolved from a combination of the best technologies of its legacy companies and was developed using a strict six-sigma process methodology. Affinity 2.0 provides solderability and uniformity while reducing waste, including gold consumption, and adhering to all IPC finish requirements. It is suitable for PCB fabricators serving automotive and telecommunications OEMs. Moreover, Affinity 2.0 is able to deliver process consistency so every pad is the same.
John Swanson, director of final finishes at MacDermid Enthone, noted, “The Affinity 2.0 development represents an excellent example of the combined skills and potential of our recently joined companies. Affinity 2.0 brings our customers best-in-class ENIG reliability, most notably through unmatched nickel corrosion performance and superior gold metal distribution. We look forward to demonstrating the cost and reliability value of Affinity to PCB fabricators, assemblers, and end users throughout this year.”